The European Commission has approved a €450 million Czech grant to support onsemi’s plan for an integrated chip manufacturing facility for SiC power devices in Rožnov pod Radhoštěm, part of a wider investment of up to €1.64 billion that aligns with the company’s long-term capital expenditure targets. The project builds on existing Czech operations, which include silicon crystal growth, silicon and silicon carbide wafer manufacturing, and a silicon wafer fab. Today, the site produces more than 3 million wafers annually. The EC said the measure is necessary to reinforce Europe’s supply-chain resilience and address limited regional capacity. Onsemi has committed to priority-rated orders during shortages and skills training, and "has agreed to share with Czechia potential profits beyond current expectations". As EC executive VP Teresa Ribera stated, “This project will improve the resilience of manufacturing industries and reduce external dependency for semiconductors.” The new facility is expected to start commercial operations by 2027.